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Adhesives Technology for Electronic Applications: Materials, by James J. Licari,Dale W. Swanson

By James J. Licari,Dale W. Swanson

This ebook is exclusive in its accomplished assurance of all points of adhesive expertise for microelectronic units and packaging, from idea to bonding to check strategies. as well as common purposes, resembling dies, substrate, and lid and chip stack attachments, the ebook contains new advancements in anisotropic, electrically conductive, and underfill adhesives. quick curing equipment comparable to UV, microwave, and moisture (which agree to present environmental and effort specifications) are coated. Over eighty tables and one hundred twenty figures offer a wealth of information on homes, functionality, and reliability. additionally integrated are examples of commercially to be had adhesives, providers, and kit. every one bankruptcy offers entire references.

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